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Fiber Laser Cut Stencil

Valtech Solution Pte Ltd uses a new Fiber Laser technology capable of producing high quality solder paste stencils for the majority of assemblies, advancements in components and PCB designs. With introduction of components like micro BGA (uBGA), Quad Flat No-Lead (QFP), the 0201s and smaller parts, the older YAG laser technology stencils struggled to produce acceptable solder paste release for these very small apertures without a reduction in the thickness of the stencil foil. However this is not always an acceptable solution as the larger components may have sufficient solder volume.
 
With the new state of the art laser cutting machine, the laser cut aperture openings is smooth with excellent trapezoidal geometries.
 
With high precision laser cut aperture openings, it enable you to have an accurate repeatability hole tolerance of less than +/- 0.2mils

Able to mamixise the efficiency of the solder paste / adhesives printings with the optimum amount of solderpaste / adhesive deposits.

Requires minimum under-stencil cleaning frequency.

Ability to perform and meets the printing requirement of Ultra Fine Pitch components

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  • Fiber Laser Cut Stencil
  • Fiber Laser Cut Stencil
  • Fiber Laser Cut Stencil

Fiber Laser Cut Stencil

Item No.:
Valtech Solution Pte Ltd uses a new Fiber Laser technology capable of producing high quality solder paste stencils for the majority of assemblies, advancements in components and PCB designs. With introduction of components like micro BGA (uBGA), Quad Flat No-Lead (QFP), the 0201s and smaller parts, the older YAG laser technology stencils struggled to produce acceptable solder paste release for these very small apertures without a reduction in the thickness of the stencil foil. However this is not always an acceptable solution as the larger components may have sufficient solder volume.
 
With the new state of the art laser cutting machine, the laser cut aperture openings is smooth with excellent trapezoidal geometries.
 
With high precision laser cut aperture openings, it enable you to have an accurate repeatability hole tolerance of less than +/- 0.2mils

Able to mamixise the efficiency of the solder paste / adhesives printings with the optimum amount of solderpaste / adhesive deposits.

Requires minimum under-stencil cleaning frequency.

Ability to perform and meets the printing requirement of Ultra Fine Pitch components

QUANTITY:
1
Add To Order Cart
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